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I BURN-IN EQUIPMENT & HARDWARE
Burn-in systems for high power devices, ASICS, memories and hybrid devices.
Systems meet stringent medical, military, telecommunication and aerospace applications.
Extensive backplane electronics for monitoring, dynamic burn-in and in-situ testing of DUT's.
II CUSTOM SOCKETS
Burn-in Sockets for Semiconductor, Hybrid, ASIC and Power Devices
Custom Sockets and Connectors
Test Sockets for High Frequency Applications (GHz
Sockets Available for all Lead & Array Geometries
III ELECTRICAL TEST SYSTEMS & SUPPORT
Test Systems Upgrades & Repair
Test Fixture Design & Fabrication
High Frequency Test Fixtures
Test System Automation
Custom Test System Design Fabrication & Interfacing
Cable & Interface Replacement
IV ENVIRONMENTAL TEST EQUIPMENT
Fine & Gross Leak Pressurization Systems
Gross Leak "Bubble Detectors"
Centrifuge Equipment
Centrifuge Fixturing For All Major Equipment Manufacturers
V THERMAL TEST AND THERMAL GRADIENT DETECTION EQUIPMENT
VI COMPONENT ASSEMBLY & PACKAGING EQUIPMENT
Void free, fluxless, vacuum, solder reflow equipment
Lead or lead free solder technology
Hermetic package sealing
Hybrid and semiconductor reflow technology
VII COMPONENT DEMOISTURIZING SYSTEMS
Eliminates moisture related package delamination
VIII SPRAY CLEANING EQUIPMENT
Bench top "hermetic" solvent spray systems
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