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VII COMPONENT DEMOISTURIZING SYSTEMS
- Eliminate captive moisture related delamination and "popcorning" in molded parts during reflow.
- 24 hour bake-out process provides functionally dry components ready for PC board assembly.
- Accommodates components in reels, tubes and trays.
- Two models available:
- CWC-158-32 for production use
- CWC-158-18 for R&D and pilot line use
Summary:
Innovative Devices Corporation provides a simple, reliable production compatible solution to the vexing problems of eliminating absorbed entrapped moisture from molded electronic components.
The CWC series system's reliably conditions parts within 24 hours which conveniently allows a board assembly house to simply demoisturize tomorrow's production parts on first shift today. Monday's parts are processed and "held" in-chamber under heat and vacuum over the weekend.
Processed parts typically enjoy a 1 - 2 day "grace period" in a reasonably moisture controlled facility or longer in N2 filled desiccator cabinets.
Simply put, moisture related component delamination and "popcorning" are things of the past using the IDC 158 series system.
Product spec page 1 and Product spec page 2
Note: Contact Micro-E for literature and assistance.
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