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Centrotherm Thermal Solutions provides thermal solutions for semiconductor and
MCM/hybrid assembly and packaging customers.
Centrotherm offers sales, service and technology support globally through a factory
application lab, sales and service facilities world-wide and, in the near future, a new
process development and application lab for the U. S. market in the Boston area with a
service facitliy in southern California.
Centrotherm also maintains significant factory research centers to continually
develop new products and processes and has formed strategic alliances among key industry
organizations.
Compomnet Assembly and Packaging Equipment:
- Void free, fluxless, vacuum, solder reflow equipment
- Lead or lead free solder technology
- Hermetic package sealing
- Hybrid and semiconductor reflow technology
- Dramatic reductions in consumable resource usage
- Dramatic reductions in floor space required
- Three models available based on production needs
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